Sitaraman, S., Jiang, L., Dag, S., Masoomi, M., Wang, Y., Lianto, P., An, J., Wang, R., See, G., Sundarrajan, A., Bazizi, E.M., Ayyagari-Sangamalli, B.: A holistic development framework for hybrid bonding. In: IEEE 72nd ECTC, pp. 691–700 (2022). https://doi.org/10.1109/ECTC51906.2022.00116 Cyanoacrylate adhesives or instant adhesives are ideal for bonding copper. Methyl cyanoacrylates such as the original Permabond 910, create strong bonds. The bonds have high shear strength; however, the application may require a structural adhesive if you are bonding copper and require resistance to polar solvents or impact. Structural Adhesives Kim, Y., Park, S., Kim, S.E.: The effect of an Ag nanofilm on low-temperature Cu/Ag–Ag/Cu chip bonding in air. Appl. Sci. 11, 9444 (2021). https://doi.org/10.3390/app11209444 During the rise in demand for copper for the Age of Electricity, from the 1880s until the Great Depression of the 1930s, the United States produced one third to half the world's newly mined copper. [116] Major districts included the Keweenaw district of northern Michigan, primarily native copper deposits, which was eclipsed by the vast sulphide deposits of Butte, Montana, in the late 1880s, which itself was eclipsed by porphyry deposits of the Southwest United States, especially at Bingham Canyon, Utah, and Morenci, Arizona. Introduction of open pit steam shovel mining and innovations in smelting, refining, flotation concentration and other processing steps led to mass production. Early in the twentieth century, Arizona ranked first, followed by Montana, then Utah and Michigan. [117] The gates of the Temple of Jerusalem used Corinthian bronze treated with depletion gilding. [ clarification needed] [ citation needed] The process was most prevalent in Alexandria, where alchemy is thought to have begun. [111] In ancient India, copper was used in the holistic medical science Ayurveda for surgical instruments and other medical equipment. Ancient Egyptians ( ~2400BC) used copper for sterilizing wounds and drinking water, and later to treat headaches, burns, and itching. [ citation needed] Modern Acid mine drainage affecting the stream running from the disused Parys Mountain copper mines 18th-century copper kettle from Norway made from Swedish copper

Beyne, E., Kim, S., Peng, L., Heylen, N., Messemaeker, J. De, Okudur, O.O., Phommahaxay, A., Kim, T., Stucchi, M., Velenis, D., Miller, A., Beyer, G.: Scalable , sub 2 μm Pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology. In: IEEE IEDM, pp. 729–732 (2017). https://doi.org/10.1109/IEDM.2017.8268486 Rebhan, B., Plach, T., Tollabimazraehno, S., Dragoi, V., Kawano, M.: Cu–Cu wafer bonding: an enabling technology for three-dimensional integration. In: IEEE ICEP, pp. 475–479 (2014). https://doi.org/10.1109/ICEP.2014.6826724Beilliard, Y., Moreau, S., Di Cioccio, D., Coudrain, P., Romano, G., Nowodzinski, A., Aussenac, F., Jouneau, P., Rolland, E., Signamarcheix, T.: Advances toward reliable high density Cu–Cu interconnects by Cu-SiO 2 direct hybrid bonding. In: IEEE International 3D Systems Integration Conference (2014). https://doi.org/10.1109/3DIC.2014.7274306 In the Roman era, copper was mined principally on Cyprus, the origin of the name of the metal, from aes cyprium (metal of Cyprus), later corrupted to cuprum (Latin). Coper ( Old English) and copper were derived from this, the later spelling first used around 1530. [7]

while identified world resources total 2.1 billion tonnes. (Source: U.S. Geological Survey, Mineral Commodity Summaries, January 2022.) The percentage of a commodity which is recycled. A higher recycling rate may reduce risk to supply. This complex exhibits the fastest water exchange rate (speed of water ligands attaching and detaching) for any transition metal aquo complex. Adding aqueous sodium hydroxide causes the precipitation of light blue solid copper(II) hydroxide. A simplified equation is: Pourbaix diagram for copper in uncomplexed media (anions other than OH- not considered). Ion concentration 0.001m (mol/kg water). Temperature 25°C. Cu 2+ + 2 OH − → Cu(OH) 2Li, J., Liang, Q., Shi, T., Fan, J., Gong, B., Feng, C., Fan, J., Liao, G., Tang, Z.: Design of Cu nanoaggregates composed of ultra-small Cu nanoparticles for Cu–Cu thermocompression bonding. J. Alloys Compd. 772, 793–800 (2019). https://doi.org/10.1016/j.jallcom.2018.09.115

I am grateful to Professor J.A. Kerr (University of Birmingham, UK) for the provision of the bond strengths of diatomic molecules data.Shirasaka, T., Okuda, T., Shibata, T., Yoneda, S., Matsukawa, D., Mariappan, M., Koyanagi, M., Fukushima, T.: Comprehensive study on advanced chip on wafer hybrid bonding with copper/polyimide systems. In: IEEE 72nd ECTC, pp. 317–323 (2022). https://doi.org/10.1109/ECTC51906.2022.00059 Lykova, M., Panchenko, I., Künzelmann, U., Reif, J., Geidel, M., Wolf, M.J., Lang, K.: Characterisation of Cu/Cu bonding using self-assembled monolayer. Solder. Surf. Mt. Technol. 30, 106–111 (2018). https://doi.org/10.1016/j.mee.2018.09.008 Kim, M.K., Park, S., Jang, A., Lee, H., Baek, S., Lee, C.S., Kim, I., Park, J., Jee, Y., Kang, U.B., Kim, D.W.: Characterization of die-to-wafer hybrid bonding using heterogeneous dielectrics. In: IEEE 72nd ECTC, pp. 335–339 (2022). https://doi.org/10.1109/ECTC51906.2022.00062